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2026-07-07

Electronica China 2026 comes to a successful conclusion | Reactor-Micro's automotive-grade chips empower the electrification and intelligence of vehicles

Publisher:Reactor-micro
Electronica China 2026 concluded successfully at the Shanghai New International Expo Center. As an annual global electronics industry exchange event, this exhibition gathered high-quality enterprises from the global electronics industry chain, focusing on core sectors such as automotive electronics, power semiconductors, and intelligent electronic control.

Reactor Microelectronics showcased its domestic automotive-grade chips and in-vehicle intelligent control solutions at the exhibition, contributing to the intelligent upgrade of automotive electrical systems and garnering numerous purchase intentions and invitations for in-depth cooperation.

Domestic automotive chips empower diverse in-vehicle scenarios

The automotive-grade chips exhibited at this exhibition are all designed and produced domestically, and have passed the AEC-Q100 automotive-grade reliability certification. They combine high reliability, miniaturization, and cost advantages, and are suitable for four core scenarios: battery management system (BMS), thermal management system (PTMS), body control module (BCM), and power distribution unit (PDU). They fully cover the electrical intelligence needs of passenger cars, commercial vehicles, and construction machinery vehicles.

Key product - Four-channel intelligent high-side switch RM77200DQ

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As a core component in the vehicle body control system, the RM77200DQ features four independent high-side load drivers and an MCU digital logic interface. It also integrates a comprehensive suite of hardware protection functions, including short-circuit current limiting protection, multi-level thermal shutdown protection, reverse polarity voltage protection, under/over-voltage protection, and ESD protection. This product is primarily designed to drive and control critical actuators that demand high diagnostic capabilities, such as interior dome lights, turn signals, brake lights, multi-channel LED/halogen drivers, small solenoid valves, and multi-channel low-power load switches.

Addressing the lightweight requirements of automakers, we adopt compact packaging, simplify peripheral circuits, and reduce overall BOM costs. At the exhibition, multiple supporting reference designs visually demonstrated the integration effect of the chip in vehicle body electronic control modules, making it a key product for commercial vehicle and construction machinery manufacturers to inquire about.

Key product - high-side MOSFET pre-driver RM7515KSF

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RM7515KSF is specifically designed for 12V high-current power switches in vehicles, featuring a built-in boost circuit that drives multiple parallel low-resistance MOSFETs, replacing mechanical relays. It emphasizes extremely low quiescent power consumption, bidirectional cut-off, and battery reverse polarity protection. Internally, it integrates key functionalities such as a built-in boost (Boost) driver, a dedicated driver for Back-to-Back topology, extremely low quiescent sleep power consumption, and a control logic interface. Additionally, it boasts integrated hardware protection features including under-voltage lockout (UVLO) protection, analog gate current monitoring (RS diagnostic pin), and built-in electrostatic discharge (ESD) protection.

The core applications of this product include the overall low-voltage battery disconnect switch for complete vehicles, the BCM body high-power load distribution module, and the start-stop system power stabilizer module, among other vehicle low-voltage electronic control systems. Currently, this product has been mass-produced and integrated into the Tier 1 systems of several leading passenger car manufacturers.

Key product - Single-channel intelligent high-side switch RM77007TSP1

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RM77007TSP1 is specifically developed for commercial vehicles and off-road construction machinery, catering to scenarios requiring continuous high current, ultra-low conduction loss, comprehensive protection, and load diagnosis. It serves as a direct replacement for high-current relays, discrete MOSFETs, and fuse solutions. This product boasts extremely low on-resistance, wide voltage compatibility, and an integrated charge pump N-MOSFET high-side solution, eliminating the need for an external bootstrap circuit and simplifying the peripheral design. Its logic input is compatible with 3.3V/5V automotive MCU levels, enabling high-level conduction.

This product integrates a wealth of hardware protection features, such as graded short circuit/overload current limiting protection, multi-level thermal shutdown protection, reverse polarity/negative voltage clamp protection, overvoltage/undervoltage protection, inductive load rapid demagnetization, and built-in ESD protection.

Currently, this product has been applied to multiple industry-leading OEMs and Tier 1 clients in the construction machinery and bus markets. It is primarily used for commercial vehicles/construction machinery 24V power distribution PDUs, new energy low-voltage power distribution units, industrial DC automation scenarios, and industrial robot joint motor protection.

The exhibition has ended, but our journey continues

The three-day Electronica China serves as a concentrated demonstration of the technological prowess of Reactor-Micro's domestic automotive-grade chips. Represented by the series of automotive-grade products such as RM77200DQ, RM7515KSF, and RM77007TSP1, these products leverage independent research and development, coupled with local mass production advantages, to provide reliable solutions for automotive electrical intelligence and localization substitution.

In the future, Reactor Microelectronics will continue to deeply explore the automotive-grade power semiconductor field, iterate on core technologies, optimize product solutions, and collaborate with industry partners to empower industrial upgrading with cutting-edge technology.